Studies on OFHC Copper (3rd Report). On Recrystallization Diagram and Grain Growth
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چکیده
منابع مشابه
Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire
Tough pitch copper wire (99.97% Cu) is generally characterized by the spiral elongation number. The principle of the test is based on the influence of impurities on the recrystallization kinetics. Alternative non-metallographic techniques to characterize the recrystallization kinetics have been investigated in this study, such as differential scanning calorimetry (D.S.C.) and residual electrica...
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Copper bonding wires were characterized using electron backscatter diffraction (EBSD). During drawing, shear components are mainly located under the surface and ,111. and ,100. fiber texture components develop with similar volume fractions. Grain average misorientation (GAM) and scalar orientation spread (SOS) of the ,100. component are lower than those of the ,111. or other orientations. Also,...
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A strong strain rate dependence on the crystallographic texture of oxygen-free high conductivity copper is observed and reported for the first time. Two shear compression specimens were deformed at widely different strain rates (0.001 s 1 and 7000 s ) to the same strain, and their textures were determined using orientation image microscopy. By comparing the stress–strain curves and the major te...
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Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The bonding wires were wire-drawn to an equivalent strain greater than 11.4 with final diameter between 25 and 30μm. Annealing treatments were carried out in a salt bath at 300°C, 400°C for 1 min, 10 min, 60 min, and 1 day. The textures of the drawn gold wires contain ma...
متن کاملRecrystallization and Grain Growth of Gold bonding Wire
Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The textures of the drawn gold wires contain major <111>, minor <100> and small fractions of complex fiber components. The <100> oriented regions are located in the center and surface of the wire, and the complex fiber component regions are located near the surface. The ...
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ژورنال
عنوان ژورنال: Journal of the Japan Institute of Metals and Materials
سال: 1958
ISSN: 0021-4876,1880-6880
DOI: 10.2320/jinstmet1952.22.10_493